Deep Dive: E6E11
The correct answer is D: Two rows of connecting pins on opposite sides of package (dual in-line package). What is a characteristic of DIP packaging used for integrated circuits is two rows of connecting pins on opposite sides of package (dual in-line package). DIP = Dual In-line Package. For amateur radio operators, this is important for component knowledge. Understanding this helps when identifying packages.
Why Other Answers Are Wrong
Option A: Incorrect. Extremely low stray capacitance isn't the characteristic - DIP has two rows of pins. Low capacitance isn't the characteristic. Option B: Incorrect. Extremely high resistance between pins isn't the characteristic - DIP has two rows of pins. High resistance isn't the characteristic. Option C: Incorrect. Two chips in each package isn't correct - DIP means dual in-line package (two rows of pins). Two chips isn't correct.
Exam Tip
DIP characteristic = two rows of connecting pins on opposite sides (dual in-line package). Think 'D'IP = 'D'ual 'I'n-'L'ine 'P'ackage. DIP = Dual In-line Package. Not low capacitance, not high resistance, not two chips - just two rows of pins.
Memory Aid
DIP characteristic = two rows of connecting pins on opposite sides (dual in-line package). Think 'D'IP = 'D'ual 'I'n-'L'ine. DIP = Dual In-line Package. Important for component knowledge.
Real-World Example
DIP packaging for integrated circuits: A characteristic is two rows of connecting pins on opposite sides of the package (dual in-line package). This is what DIP stands for - Dual In-line Package. This is the characteristic - two rows of pins.
Source & Coverage
Question Pool: 2024-2028 Question Pool
Subelement: E6E
Reference: 2024-2028 Question Pool · E6 - Circuit Components
Key Concepts
Verified Content
Question from the official FCC Extra Class pool. Explanation reviewed by licensed amateur radio operators and mapped to the E6E topic.