Deep Dive: E6E02
The correct answer is A: DIP. Which of the following device packages is a through-hole type is DIP. DIP (Dual In-line Package) is a through-hole package. For amateur radio operators, this is important for component knowledge. Understanding this helps when selecting components.
Why Other Answers Are Wrong
Option B (PLCC): Incorrect. PLCC is surface-mount, not through-hole - DIP is through-hole. PLCC isn't through-hole. Option C (BGA): Incorrect. BGA is surface-mount, not through-hole - DIP is through-hole. BGA isn't through-hole. Option D (SOT): Incorrect. SOT is surface-mount, not through-hole - DIP is through-hole. SOT isn't through-hole.
Exam Tip
Through-hole package = DIP. Think 'D'IP = 'D'irect 'I'nsertion 'P'ackage (through-hole). DIP (Dual In-line Package) is a through-hole package. Not PLCC (surface-mount), not BGA (surface-mount), not SOT (surface-mount) - just DIP.
Memory Aid
Through-hole package = DIP. Think 'D'IP = 'T'hrough-'H'ole. DIP (Dual In-line Package) is a through-hole package. Important for component knowledge.
Real-World Example
Device packages: DIP is a through-hole type. DIP (Dual In-line Package) has pins that go through holes in the circuit board. This is the package - DIP is through-hole.
Source & Coverage
Question Pool: 2024-2028 Question Pool
Subelement: E6E
Reference: 2024-2028 Question Pool · E6 - Circuit Components
Key Concepts
Verified Content
Question from the official FCC Extra Class pool. Explanation reviewed by licensed amateur radio operators and mapped to the E6E topic.